BPA(10)EODMA CAS 41637-38-1

CAS:41637-38-1

Foromo ea molek'hule:(C2H4O)n(C2H4O)nC23H24O4

Boima ba Molek'hule:452

EINECS:609-946-4

Nako ea polokelo:1 selemo

Synonym:DPD1; TGFB; Diaphyseal dysplasia 1; E tsoelang pele; Diethyl carbote

Tlohela Molaetsa wa Hao

Lintlha tsa Sehlahisoa

Khoasolla

Li-tag tsa Sehlahisoa

BPA(10)EODMA CAS 41637-38-1 ke eng?

Diethyl carbonate ke mofuta oa mokelikeli o se nang 'mala le o bonaletsang o monko o monate hanyane. Ha e qhibilihe ka metsing, e qhibiliha ka har'a lihlapolli tsa tlhaho tse kang joala le ether.

Tlhaloso

ITEM	TS'ELISO
Ponahalo	E hlakileng le e pepeneneng
Viscosity	350 ~ 450 cP
Boleng ba asiti	≤0.50 mg KOH/g
Mmala	≤100 APHA
Matla a khoheli a khethehileng	1.110 ~ 1.130

Kopo

(1) Lisebelisuoa tse phekotsoeng ke UV (UV curing
Liaparo le li-inks
Joalo ka mokelikeli o sebetsang, o sebelisoa liphahlong tse phekolehang ka UV (joalo ka mapolanka le litšepe) ho matlafatsa ho thatafala le ho hanyetsa lik'hemik'hale.
Fokotsa khatello ea maikutlo ho enke ea khatiso ho thibela deformation ea substrate.

Resin ea khatiso ea 3D
Reactivity e phahameng le viscosity e tlase e etsa hore e tšoanelehe bakeng sa khatiso ea 3D e phekolehang habonolo (e kang mefuta ea meno le likarolo tse nepahetseng).

(2) Lisebelisoa tsa meno
Resin e kopantsoeng
Ha e kopantsoe le likhalase tsa khalase (tse kang SiO₂), e sebelisoa ka thepa ea ho tsosolosa meno (ho tlatsa, li-veneers), tse nang le matla le aesthetics ka bobeli.

Sekhomaretsi:
E le karolo ea li-adhesives tsa meno, e phekola ka potlako 'me e na le biocompatibility e ntle.

(3) Liphutheloana tsa elektronike
Lintho tse sireletsang
Sekhomaretsi sa encapsulation bakeng sa PCB (boto e hatisitsoeng ea Circuit), e thibelang mocheso le mongobo.

Setsebi sa lifoto
E le karolo ea resin ea photosensitive, e sebelisoa ts'ebetsong ea graphical ea tlhahiso ea semiconductor.

(4) Sekgomaretsi
Sekgomaretsi sa sebopeho
Ha e kopantsoe le epoxy resin, e matlafatsa ho tiea le ho khomarela (joalo ka ho kopanya likoloi le sefofane).